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PCB assemblies adopt HDI, multilayer PCBs, IC substrates

Suppliers are directing the line toward the high end and undertaking production expansion.

China’s PCB assembly industry continues to grow at a fast pace, with companies broadening upscale selections and boosting manufacturing capacity while exploring new applications. They are leveraging the country’s majority output share in the strong mobile phone, computer, LED and automotive markets to advance the segment. China is responsible for 70 percent of the global yield of handsets, more than 50 percent of tablet PCs, 30 percent of diode-based products and 50 percent of vehicle relays. In the third category, it has overtaken Japan and South Korea.

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Note: This article "PCB assemblies adopt HDI, multilayer PCBs, IC substrates" was originally published by Global Sources, a leading business-to-business media company and a primary facilitator of trade with China manufacturers and India suppliers, providing essential sourcing information to volume buyers through e-magazines and trade shows.

All price quotes in this report are in US dollars unless otherwise specified. FOB prices were provided by the companies interviewed only as reference prices at the time of interview and may have changed.

Disclaimer: All product images are provided by the companies interviewed and are for reference purposes only. Those product images featuring products with trademarks, brand names or logos are not intended for sale. We, our affiliates, and our affiliates' respective directors, officers, employees, representatives, agents or contractors, do not accept and will not have any responsibility or liability for product images (or any part thereof) which infringe on any intellectual property or other rights of a third party.

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