Better dielectric materials are used to suit elevated-temperature applications such as LED lighting. Suppliers sustain R&D on finer circuit density.
Enhanced thermal conductivity constitutes the key trend in China’s aluminum-base PCB line. Manufacturers aim to increase penetration of the expanding LED market and other applications such as power supplies, and computer and communication products requiring high-temperature heat dissipation solutions. Companies adopt aluminum-base CCLs with a ceramic filler to realize 1 to 5W/m•K in mainstream models and up to 9W/m•K in advanced kinds. In contrast, earlier types that employed mainly epoxy resin, epoxy-filled glass fiber or polyimide reached less than 1W/m•K only. The use of CCLs ensures greater dielectric strength as well.
All price quotes in this report are in US dollars unless otherwise specified. FOB prices were provided by the companies interviewed only as reference prices at the time of interview and may have changed.