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Aluminum-base PCB makers highlight improved thermal conductivity

Better dielectric materials are used to suit elevated-temperature applications such as LED lighting. Suppliers sustain R&D on finer circuit density.

Enhanced thermal conductivity constitutes the key trend in China’s aluminum-base PCB line. Manufacturers aim to increase penetration of the expanding LED market and other applications such as power supplies, and computer and communication products requiring high-temperature heat dissipation solutions. Companies adopt aluminum-base CCLs with a ceramic filler to realize 1 to 5W/m•K in mainstream models and up to 9W/m•K in advanced kinds. In contrast, earlier types that employed mainly epoxy resin, epoxy-filled glass fiber or polyimide reached less than 1W/m•K only. The use of CCLs ensures greater dielectric strength as well.

 

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Note: This article "Aluminum-base PCB makers highlight improved thermal conductivitywas originally published by Global Sources, a leading business-to-business media company and a primary facilitator of trade with China manufacturers and India suppliers, providing essential sourcing information to volume buyers through e-magazines and trade shows.

All price quotes in this report are in US dollars unless otherwise specified. FOB prices were provided by the companies interviewed only as reference prices at the time of interview and may have changed.

Disclaimer: All product images are provided by the companies interviewed and are for reference purposes only. Those product images featuring products with trademarks, brand names or logos are not intended for sale. We, our affiliates, and our affiliates' respective directors, officers, employees, representatives, agents or contractors, do not accept and will not have any responsibility or liability for product images (or any part thereof) which infringe on any intellectual property or other rights of a third party.

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